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[1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12] 3GPP, R5, TR 26.975, Performance Characterization of the AMR, v. 5.0.0. 3GPP, R6, TS 23.107, Quality of Service (QoS) Concept and Architecture, v. 6.1.0. 3GPP, R6, TS 23.060, General Packet Radio Service (GPRS); Service Description, v. 6.10.0. 3GPP TS, R6, 29.060, GPRS Tunnelling Protocol (GTP) across the Gn and Gp Interface, v. 6.10.0. 3GPP, R6, TS 24.008, Mobile Radio Interface Layer 3 Speci cation; Core Network Protocols, v. 6.10.0. 3GPP, R5, TS 32.215, Telecommunication Management; Charging Management; Charging Data Description for the Packet Switch (PS) Domain, v. 5.9.0. 3GPP, R6, TS 29.002, Mobile Application Part (MAP) Speci cation, v. 6.11.0. 3GPP, R6, TS 29.078, Customised Applications for Mobile Network Enhanced Logic (CAMEL) Phase 4; CAMEL Application Part (CAP) Speci cation, v. 6.4.0. 3GPP, R6, TS 29.061, Interworking between the Public Land Mobile Network (PLMN) Supporting Packet Based Services and Packet Data Networks (PDN), v. 6.6.0. G. Armitage, Quality of Service in IP Networks: Foundations for a Multi-Service Internet, 1st Edition, April 2000, Macmillan Technical Publishing. R. Cuny and J. Lakkakorpi, Active queue management in EGPRS, submitted to IEEE 63rd Vehicular Technology Conference, 7 10 May 2006. 3GPP, R6, TS 48.018, General Packet Radio Service (GPRS); Base Station System (BSS)Serving GPRS Support Node (SGSN); BSS GPRS Protocol (BSSGP), v. 6.11.0.

This absorption occurs in distinct bands that become progressively closer together, as wavelength increases, rendering the region beyond 2 m (2000 nm) unusable for transmission in a silica-based glasses [658] Injection laser Another term for a semiconductor or laser diode Insulator Nonconductive dielectric lms used to isolate electrically active areas of the device or chip from one another Some commonly used insulators are silicon dioxide, silicon nitride, boro-phospho-silicate glass (BPSG), and phospho-silicate glass (PSG) [656] Integrated circuit (IC) Fabrication technology that combines components of a circuit on a wafer [656] An interconnected array of active and passive elements integrated with a single semiconductor substrate or deposited on the substrate by a continuous series of compatible processes and capable of performing at least one complete electronic circuit function Also known as integrated semiconductor [689].

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FIGURE 7.56 Measured antenna gain in the broadside direction for the antenna studied in Figure 7.54 with c = 40 . (From Ref. 27, C 1999 John Wiley & Sons, Inc.)

and di erentiated with respect to each of the coe cients, da , and setting the result equal to zero, nCI qE CI 2 db pa Hpb dt E CI dab 0 qda b 1 AX88

Integrated photonic circuits (microphotonic integrated circuits) Circuits where light is guided in optical waveguides that are rendered on a planar substrate For example, passive devices such as optical splitters and multiplexers can be made by proper materials design and engineering Next-generation devices that could replace the CMOS technology below the 10- to 5-nm frontier will likely be based on new technologies: optoelectronic and quantum properties of nanometer-scale devices will probably be the basis of alternative technologies [293] Intensity Measure of the time-averaged energy ux De ned as the energy density (ie, the energy per unit volume) multiplied by the velocity at which the energy is moving The resulting vector has the units of W/m2 Interaction Process in which a particle decays or responds to a force due to the presence of another particle (as in a collision).

A comparability protocol is a well-de ned, detailed, written plan for assessing the effect of speci c CMC changes in the identity, strength, quality, purity, and potency of a speci c drug product as these factors relate to the safety and effectiveness of the product. A comparability protocol describes the changes that are covered under the protocol and speci es the tests and studies that will be performed, including the analytical procedures that will be used, and acceptance criteria that will be achieved to demonstrate that speci ed CMC changes do not adversely affect the product. The submission of a comparability protocol is optional.

Space is often needed to create a margin between an image and text such as with Left or Right align. Keep in mind that HSpace adds space to the both the left and right sides of an image, which may not be what you want in your layout. An example is if you have a leftaligned image and you want to add a margin of space between the image and text on the right. When you use HSpace, you get the same amount of margin on both sides of the image. This pushes the text to the right away from the image, but also pushes the image to the right away from the left page or cell margin and therefore out of alignment with whatever is below it. In cases such as this it is better to add the margin you want to the artwork in a graphics program such as Photoshop.

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